SK Hynix partners with TSMC to develop next-gen HBM4 chips, which are critical for AI and slated for mass production in 2026, and advanced chip packaging tech (Nikkei Asia)

Nikkei Asia:

SK Hynix partners with TSMC to develop next-gen HBM4 chips, which are critical for AI and slated for mass production in 2026, and advanced chip packaging tech  —  Asian chipmakers aim to supply next-generation high-bandwidth memory for Nvidia  —  SEOUL/TAIPEI — SK Hynix …