Samsung plans to invest ~$280M over five years in a chip packaging research facility in Yokohama, Japan and will receive up to ~$140M in government subsidies (Reuters)

Reuters:

Samsung plans to invest ~$280M over five years in a chip packaging research facility in Yokohama, Japan and will receive up to ~$140M in government subsidies  —  South Korea’s Samsung Electronics (005930.KS) will invest around 40 billion yen ($280 million) over five years in a facility …