Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process.

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Introduction

At the 4th of April I published an article about BE Semiconductor (OTC:BESIY) as a great long term holding in a dividend (growth) portfolio.

Since then a lot has happened with the share price. The stock price at publication

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