Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process.

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Standex International Corporation (NYSE:SXI) recently delivered better than expected EPS Actual, and announced new transactions to be closed in 2024 as well as restructuring efforts for 2024 and 2025. Moreover, with expositions to growing sectors, like renewable energy and electric vehicles, and a

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